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Foxconn Interconnect Technology, Inc. (“FIT”) is seeking Field Applications Engineer to join as a valued member of sales team in the Irvine, CA office.

 

Job Title: Field Applications Engineer

Job Location: Bellevue, WA

Duties and Responsibilities:

  • Reviews the 2D drawings and 3D CADs with both customers and back-end manufacturing engineers to identify potential issues and optimization
  • Work with assigned customer base in designing in FIT interconnect products along with managing the commercial aspect of the business within the assigned account base.
  • Experience in the interconnect industry is a plus but not required.
  • Experience interfacing with customers is highly desirable.
  • Familiarity and experience with CAD software (SolidWorks) is strongly preferred.
  • Competent oral and written communication skills and an ability to initiate and sustain positive customer relationships.

Education and Experience:

  • College B.S or B.A. degree in Mechanical Engineering.
  • Minimum 1-2 years as a Design Engineer, Project Manager or Application Engineer
  • Self-motivated and be able to work with minimal supervision and utilize existing knowledge and sound judgement to thrive in a dynamic environment.
  • CAD drafting capability: Solid works experience is a plus.
  • Customer interface and/or sales experience in an OEM assignment is a plus. Experience with Finite Element Analysis is a plus
  • Excellent communication and interpersonal skills
  • Fluent in both English and Chinese (mandarin), oral and written.
  • Able to travel internationally (mostly to Asia) up to 25%

 

Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.